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[IEEE 2012 7th International Conference on Electrical & Computer Engineering (ICECE) - Dhaka, Bangladesh (2012.12.20-2012.12.22)] 2012 7th International Conference on Electrical and Computer Engineering - Finite element analysis of thermal stress in Through-Silicon Via structure
Sultana, Tanzia, Alam, Md. Nafiul, Hossain, Md. FaruqueYear:
2012
Language:
english
DOI:
10.1109/icece.2012.6471485
File:
PDF, 778 KB
english, 2012