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Surface Microstructural Evolution up to Creep Rupture under the Power-Law Regime in Cu-8.5at%Al Alloy at Intermediate Temperatures
Abo-Elsoud, M.Volume:
251-252
Year:
2006
Language:
english
Journal:
Defect and Diffusion Forum
DOI:
10.4028/www.scientific.net/ddf.251-252.97
File:
PDF, 543 KB
english, 2006