[IEEE 2012 IEEE International Symposium on Electromagnetic Compatibility - EMC 2012 - Pittsburgh, PA, USA (2012.08.6-2012.08.10)] 2012 IEEE International Symposium on Electromagnetic Compatibility - Modeling of coupled TSVs in 3D ICs
Engin, A. Ege, Raghavan, N. SrinidhiYear:
2012
Language:
english
DOI:
10.1109/isemc.2012.6351759
File:
PDF, 401 KB
english, 2012