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[IEEE 2013 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Nara, Japan (2013.12.12-2013.12.15)] 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) - Time-domain analysis of circuits with frequency-dependent elements using a SPICE-like solver
Dou, Yuhang, Yeung, Lap K., Wu, Ke-LiYear:
2013
Language:
english
DOI:
10.1109/edaps.2013.6724422
File:
PDF, 473 KB
english, 2013