[IEEE 2014 15th International Conference on Thermal,...

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Kozic, Darjan, Treml, Ruth, Schongrundner, Ronald, Brunner, Roland, Kiener, Daniel, Antretter, Thomas, Ganser, Hans-Peter

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Year:

2014

Language:

english

DOI:

10.1109/eurosime.2014.6813785

File:

PDF, 1.01 MB

english, 2014

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