[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip
Kai Zhang,, Guo-Wei Xiao,, Wong, C.K.Y., Hong-Wei Gu,, Yuen, M.M.F., Chan, P.C.H., Bing Xu,Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/ectc.2005.1441246
File:
PDF, 780 KB
english, 2005