[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Through mold via technology for multi-sensor stacking
Braun, T., Brundel, M., Becker, K.-F, Kahle, R., Piefke, K., Scholz, U., Haag, F., Bader, V., Voges, S., Thomas, T., Aschenbrenner, R., Lang, K.-DYear:
2012
Language:
english
DOI:
10.1109/eptc.2012.6507099
File:
PDF, 2.28 MB
english, 2012