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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermal conductivity and morphology of non-covalent functionalized graphene/epoxy nanocomposites
Teng, Chih-Chun, Ma, Chen-Chi M., Chiou, Kuo-Chan, Lee, Tzong-MingYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699637
File:
PDF, 544 KB
english, 2010