Comparative study of electroless copper deposition based on...

Applied Surface Science 2009 Vol. 255; Iss. 6

Comparative study of electroless copper deposition based on the seed layers of Pd, PtPd and AuPd

Chuanli Ma, Weichun Ye, Xuezhao Shi, Yanlong Chang, Yang Chen, Chunming Wang
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Volume:
255
Year:
2009
Language:
english
Pages:
6
DOI:
10.1016/j.apsusc.2008.10.024
File:
PDF, 1.40 MB
english, 2009
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