Extreme wettability due to dendritic copper nanostructure...

Extreme wettability due to dendritic copper nanostructure via electrodeposition

Peng Wang, Dun Zhang, Ri Qiu
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Volume:
257
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.apsusc.2011.04.126
File:
PDF, 653 KB
english, 2011
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