Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition
Wang, B., Eberhardt, W., Kück, H.Volume:
18
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1163/156856104840480
Date:
January, 2004
File:
PDF, 1.85 MB
english, 2004