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Development and Application of Hybrid Mold with Microfeatures in Micro-Hot Embossing
Kuo, Chil-Chyuan, Hsu, Hsiu-JuVolume:
28
Language:
english
Journal:
Materials and Manufacturing Processes
DOI:
10.1080/10426914.2013.832305
Date:
November, 2013
File:
PDF, 1.83 MB
english, 2013