[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits
Roullard, J., Capraro, S., Farcy, A., Lacrevaz, T., Bermond, C., Leduc, P., Charbonnier, J., Ferrandon, C., Fuchs, C., Flechet, B.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898659
File:
PDF, 3.82 MB
english, 2011