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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Manufacturing of complex bi-porous wick and applying to a loop heat pipe
Wu, Shen-Chun, Chen, Sheng-Hao, Lin, Fang-Zhou, Yeh, Chien-Chih, Wang, Shen-Kai, Chen, Yau-MingYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699654
File:
PDF, 169 KB
english, 2010