Influence of dicing damages on the thermo-mechanical reliability of bare-chip assemblies
Steiert, M., Wilde, J.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.08.005
Date:
September, 2014
File:
PDF, 1.96 MB
english, 2014