[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Process characteristics of a 2.5D silicon module using embedded technology as a feasible solution for system integration and thinner form-factor
Cheng, Ren-Shin, Hung, Yin-Po, Kuo, Tzu-Ying, Lin, Yu-Min, Leu, Fan-Jun, Chang, Tao-ChihYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575849
File:
PDF, 1.58 MB
english, 2013