Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives
Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi, Schroder, Kurt A.Volume:
119
Language:
english
Journal:
Journal of Thermal Analysis and Calorimetry
DOI:
10.1007/s10973-014-4195-3
Date:
January, 2015
File:
PDF, 1.11 MB
english, 2015