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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Reactive multilayer foils for MEMS wafer level packaging
Qiu, Xiaotun, Zhu, Jie, Oiler, Jon, Yu, HongyuYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074181
File:
PDF, 872 KB
english, 2009