Electroless copper on refractory and noble metal substrates with an ultra-thin plasma-assisted atomic layer deposited palladium layer
Young-Soon Kim, Hyung-Il Kim, Joong-Hee Cho, Hyung-Kee Seo, M.A. Dar, Hyung-Shik Shin, Gregory A. Ten Eyck, Toh-Ming Lu, Jay J. SenkevichVolume:
51
Year:
2006
Language:
english
Pages:
7
DOI:
10.1016/j.electacta.2005.07.018
File:
PDF, 245 KB
english, 2006