New formation process of plating thin films on several...

New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process

Tetsuya Osaka, Masahiro Yoshino
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Volume:
53
Year:
2007
Language:
english
Pages:
7
DOI:
10.1016/j.electacta.2007.04.004
File:
PDF, 848 KB
english, 2007
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