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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Low cost, room temperature debondable spin-on temporary bonding solution: A key enabler for 2.5D/3D IC packaging
John, Ranjith Samuel E., Meynen, Herman, Wang, Sheng, Fu, Peng-Fei, Yeakle, Craig, Kim, Sang Wook W., Larson, Lyndon J., Sullivan, ScottYear:
2013
Language:
english
DOI:
10.1109/ECTC.2013.6575558
File:
PDF, 683 KB
english, 2013