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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - The 1st Level & 2nd Level Solder Joint Reliability Co-design for Larger Die Flip Chip Package
Biswas, Kalyan, Liu, Shiguo, Zhang, Xiaowu, Chai, TCYear:
2007
Language:
english
DOI:
10.1109/EPTC.2007.4469772
File:
PDF, 543 KB
english, 2007