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[IEEE 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - formerly known as the Semiconductor Conference Dresden (SCD) - Grenoble, France (2012.09.24-2012.09.26)] 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) - Reliability tests on micro-insert die bonding technology
Nowodzinski, Antoine, Boutry, Herve, Franiatte, Remy, Mandrillon, Vincent, Anciant, Romain, Verrun, Sophie, Simon, GillesYear:
2012
Language:
english
DOI:
10.1109/ISCDG.2012.6359983
File:
PDF, 1.57 MB
english, 2012