[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Modal analysis and dynamic responses of board level drop test
Jing-en Luan,, Tong Yan Tee,, Pek, E., Chwee Teck Lim,, Zhaowei Zhong,Year:
2003
Language:
english
DOI:
10.1109/EPTC.2003.1271522
File:
PDF, 828 KB
english, 2003