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[IMAPS - Int. Microelectron. & Packaging Soc International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (6-8 March 2000)] Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) - Formation, distribution and failure effects of voids in vapor-phase soldered small solder volumes
Villain, J., Beschorner, M., Hacke, H.J., Brabetz, B., Zapf, J.Year:
2000
Language:
english
DOI:
10.1109/ISAPM.2000.869258
File:
PDF, 266 KB
english, 2000