[IEEE ESSDERC 2003. 33rd European Solid-State Device...

  • Main
  • [IEEE ESSDERC 2003. 33rd European...

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Electrical analysis of mechanical stress induced by shallow trench isolation [MOSFETs]

Gallon, C., Reimbold, G., Ghibaudo, G., Blanchi, R.A., Gwoziecki, R., Raynaud, C.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2003
Language:
english
DOI:
10.1109/ESSDERC.2003.1256888
File:
PDF, 282 KB
english, 2003
Conversion to is in progress
Conversion to is failed