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[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - Finite Element Analysis and Fatigue Life Prediction of BGA Mixed Solder Joints
Ting-biao, Jiang, Chao, Du, Long-hui, XuYear:
2007
Language:
english
DOI:
10.1109/HDP.2007.4283611
File:
PDF, 368 KB
english, 2007