IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1996 / Sept. Vol. 19; Iss. 3
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Thermal modeling of electrical contacts in switches and relays
Leung, C.H., Lee, A., Bor-Jenq Wang,Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.536836
Date:
January, 1996
File:
PDF, 863 KB
english, 1996