[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Melting Temperature and Physical Properties of Sn-Ag-Cu-Mg Lead-Free Solders Based on Uniform Design
Lu, Sheng, Wang, Baohua, Wei, Chenggang, Chen, Jing, Wang, WeijunYear:
2007
Language:
english
DOI:
10.1109/ICEPT.2007.4441440
File:
PDF, 1.49 MB
english, 2007