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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Structural and compositional optimization of advanced fan-in WLCSPs base on FEA simulation
Guo, Hong Yan, Qin, Shun Jin, Zhang, Li, Tan, KH, Lai, CMYear:
2012
Language:
english
DOI:
10.1109/ICEPT-HDP.2012.6474560
File:
PDF, 1.13 MB
english, 2012