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[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM electro-thermal modelling
Marcault, E., Massol, J. L., Tounsi, P., Dorkel, J. M.Year:
2013
Language:
english
DOI:
10.1109/EuroSimE.2013.6529957
File:
PDF, 1.29 MB
english, 2013