[IEEE 2013 14th International Conference on Thermal,...

  • Main
  • [IEEE 2013 14th International...

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Impact of circuit load on the ageing mode of VDMOS chips using 3D FEM electro-thermal modelling

Marcault, E., Massol, J. L., Tounsi, P., Dorkel, J. M.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2013
Language:
english
DOI:
10.1109/EuroSimE.2013.6529957
File:
PDF, 1.29 MB
english, 2013
Conversion to is in progress
Conversion to is failed