[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - CMOS wafer bonding for back-side illuminated image sensors fabrication
Dragoi, V., Filbert, A., Zhu, S., Mittendorfer, G.Year:
2010
Language:
english
DOI:
10.1109/ICEPT.2010.5582379
File:
PDF, 878 KB
english, 2010