[IEEE 2012 14th International Conference on Electronic...

  • Main
  • [IEEE 2012 14th International...

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Development of thermal fatigue sensor for electrical and electronic equipment

Minakata, Yuya, Yu, Qiuang, Takagi, Kanji
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2012
Language:
english
DOI:
10.1109/EMAP.2012.6507847
File:
PDF, 478 KB
english, 2012
Conversion to is in progress
Conversion to is failed