Effect of Solder Joint Arrangements on BGA Lead-Free...

IEEE Transactions on Components Packaging and Manufacturing Technology 2012 / 12 Vol. 2; Iss. 12

Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process

Lau, Chun-Sean, Abdullah, Mohd Zulkifly, Ani, Fakhrozi Che
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Volume:
2
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2012.2213341
Date:
December, 2012
File:
PDF, 2.39 MB
english, 2012
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