[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Ball impact responses and failure analysis of wafer-level chip-scale packages
Lai, Yi-Shao, Yeh, ChangLlin, Chang, Hsiao-Chuan, Kao, Chin-LiYear:
2006
Language:
english
DOI:
10.1109/EPTC.2006.342712
File:
PDF, 898 KB
english, 2006