[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - The measurement developing of wafer level MEMS microphone
Hui-Chuan Lu,, Wei-Liang Chan,, Hsui-Li Lee,, Yu-Jen Fang,, Chieh-Ling Hsiao,, Chih-Hung Wang,, Peter Chang,, Chin-Ching Huang,, Ming-Te Tu,Year:
2007
Language:
english
DOI:
10.1109/IMPACT.2007.4433559
File:
PDF, 618 KB
english, 2007