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[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Stress impact of thermal-mechanical loads measured with the stress chip
Schindler-Saefkow, F., Rost, F., Otto, A., Keller, J., Winkler, T., Wunderle, B., Michel, B., Rzepka, S.Year:
2013
Language:
english
DOI:
10.1109/THERMINIC.2013.6675235
File:
PDF, 3.46 MB
english, 2013