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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - A stress relief method for copper filled through silicon via with parylene on sidewall
Wenping Kang,, Maosheng Zhang,, Yunhui Zhu,, Shenglin Ma,, Min Miao,, Yufeng Jin,Year:
2010
Language:
english
DOI:
10.1109/ICEPT.2010.5582478
File:
PDF, 751 KB
english, 2010