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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Metal lift failure modes during fine pitch wire bonding low-k devices with Bond Over Active (BOA) design
Chu-Chung Lee,, Tu Anh Tran,, Au, Yin KhengYear:
2010
Language:
english
DOI:
10.1109/EPTC.2010.5702601
File:
PDF, 1.88 MB
english, 2010