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[IEEE 2006 29th International Spring Seminar on Electronics Technology - St. Marienthal, Germany (2006.05.10-2006.05.14)] 2006 29th International Spring Seminar on Electronics Technology - Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints
Bohme, Bjorn, Rollig, Mike, Wiese, Steffen, Wolter, Klaus-JurgenYear:
2006
Language:
english
DOI:
10.1109/ISSE.2006.365354
File:
PDF, 457 KB
english, 2006