[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Low-pressure CMP for reliable porous low-k/Cu integration
Kondo, S., Tokitoh, S., Yoon, B.U., Namiki, A., Sone, A., Ohashi, N., Misawa, K., Sone, S., Shin, H.J., Yoshie, T., Yoneda, K., Shimada, M., Ogawa, S., Matsumoto, I., Kobayashi, N.Year:
2003
Language:
english
DOI:
10.1109/IITC.2003.1219720
File:
PDF, 213 KB
english, 2003