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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Failure Analysis of In/Au Solder Joints
Ma, Lili, Bao, Shengxiang, Peng, Jing, Du, ZhiboYear:
2006
Language:
english
DOI:
10.1109/ICEPT.2006.359771
File:
PDF, 3.74 MB
english, 2006