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Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
Cheng, Y.-T., Wan-Tai Hsu,, Najafi, K., Nguyen, C.T.-C., Liwei Lin,Volume:
11
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/JMEMS.2002.802903
Date:
October, 2002
File:
PDF, 412 KB
english, 2002