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Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM
Chi-ming Lai, R.H. Chen, Ching-Yao LinVolume:
42
Year:
2010
Language:
english
Pages:
8
DOI:
10.1016/j.enbuild.2010.02.018
File:
PDF, 1.06 MB
english, 2010