[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Modeling of heat transfer performance for an array of micro jets impinging upon dimpled surface
Geng, Tian-yi, Fan, Jing-yu, Zhang, Yan, Wang, ShunYear:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270743
File:
PDF, 880 KB
english, 2009