[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Process and characterization of ultra-thin film packages
Kuo, Tzu-Ying, Hsiao, Zhi-Cheng, Hung, Yin-Po, Li, Wei, Chen, Kuo-Chyuan, Hsu, Chao-Kai, Ko, Cheng-Ta, Chen, Yu-HuaYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699606
File:
PDF, 234 KB
english, 2010