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[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Jian Chen,, Hong Meng Ho,, Wai Lam,, Ratchev, P., Stoukatch, S., Beyne, E., Vath, C.J., De Wolf, I.Year:
2002
Language:
english
DOI:
10.1109/EPTC.2002.1185598
File:
PDF, 466 KB
english, 2002