[IEEE Exhibition - Singapore (2008.05.19-2008.05.23)] 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility - Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias
Jun So Pak,, Chunghyun Ryu,, Jaemin Kim,, Yujeong Shim,, Gawon Kim,, Joungho Kim,Year:
2008
DOI:
10.1109/APEMC.2008.4559884
File:
PDF, 676 KB
2008