![](/img/cover-not-exists.png)
[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Noble Failure Analysis procedure for trench MOSFET technology devices through detail electrical parameter characterization and unique Fault Isolation technique
Yahya, Abul Khair, Yusof, Nik Tajuddin, Yusof, Yusnani MohamadYear:
2012
Language:
english
DOI:
10.1109/IPFA.2012.6306269
File:
PDF, 1.25 MB
english, 2012