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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Reliability of wafer level thin film MEMS packages during wafer backgrinding
Zaal, J. J. M., van Driel, W. D., Verheijden, G. J. A. M., Zhang, G. Q.Year:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270664
File:
PDF, 1.15 MB
english, 2009